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DDi Corp. (ticker: DDIC, exchange: NASDAQ Global Market (.O)) News Release - 17-Dec-2001

DDi Corp. to Sponsor Virginia Universities' PCB Design and Manufacturing Research and Development Project

ANAHEIM, Calif., Dec 17, 2001 /PRNewswire via COMTEX/ --

- Joint Sponsorships Will Fund Establishment of Center for Advanced PCB Design and Manufacturing Technology - Center to Function as Both DDi Commercial Design and Engineering Operation and University Research and Education Facility - Project Awarded $1.4 Million in Funding From State of Virginia

DDi Corp. (Nasdaq: DDIC), a leading provider of time-critical, technologically advanced interconnect services for the electronics industry, today announced that it will participate in collaborative sponsorship of a printed circuit board technology project benefiting the high technology and electronics engineering academia of two leading Virginia universities. DDi will oversee the operations of the Center for Advanced Printed Circuit Board Design and Manufacturing Technology. The Center will be funded and supported in collaboration with Virginia Commonwealth University and the University of Virginia and the other industry sponsors, DuPont, Panasonic and Zuken.

"Our participation in this important endeavor exemplifies DDi's leadership in the design and manufacture of complex, technologically advanced printed circuit boards," said Bruce McMaster, Chief Executive Officer of DDi Corp. "We believe this project is an significant development for the electronics manufacturing services industry as a whole in promoting the focus on PCB manufacture as an important academic course of study within technology and electronics."

Brian McDermott, Director of Technology for DDi Corp. commented, "This is a mutually beneficial project for high-technology education in the State of Virginia, as well as for DDi's commercial operations on the East Coast. State-matched funds will offset the start-up costs for this new design and engineering center, which will operate as a DDi business unit, initiating work for our existing Virginia PCB manufacturing operations, while supporting activities on behalf of the other sponsors. At the same time, the facility will serve as a student research and activity center, offering university scientists and graduate students the opportunity to work with our expert designers and engineers to experience the most advanced technologies and processes related to high speed and high density interconnect design."

The State of Virginia, through Governor Jim Gilmore's Commonwealth Technology Research Fund, has agreed to match the funds contributed for the Center's operational expenses including set up costs, staffing and equipment. Grants through the Fund are presented to research projects that seek to increase the capacity for research in areas key to economic development and that are aimed at attracting high-tech industrial development in the State of Virginia. Additionally, the project was recently awarded a grant totaling $1.4 million over three years from the State of Virginia for initial start-up and development.

The Richmond, Virginia-based Center for Advanced Printed Circuit Board Design and Manufacturing Technology is expected to commence operations during the first quarter of 2002. The Center will function as an academic center for graduate students and researchers from Virginia Commonwealth University and the University of Virginia.

About DDi Corp.

DDi is a leading provider of time-critical, technologically advanced design, development and manufacturing services. Headquartered in Anaheim, California, with design and manufacturing facilities across North America and in England, DDi and its subsidiaries service over 2,000 customers worldwide. DDi Corp. common stock trades on the Nasdaq National Market.

This press release may contain information about future expectations, plans and prospects that may constitute forward-looking statements for purposes of the Safe Harbor provisions under the Private Securities Litigation Reform Act of 1995. Statements made by Messrs. McMaster and McDermott herein constitute such forward-looking statements. Actual results or developments may differ materially from those projected or implied in the forward-looking statements. More information about the risks and challenges faced by DDi Corp. is contained in the Securities and Exchange Commission filings made by DDi and its subsidiaries. DDi Corp. specifically disclaims any obligation to update or revise any forward-looking statements whether as a result of new information, future developments or otherwise.

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SOURCE DDi Corp.


CONTACT:
Joe Gisch, Chief Financial Officer of DDi Corp.,
+1-714-688-7200; or Kristen McNally, General Information/Media,
+1-310-996-7458, kmcnally@webershandwick.com, or Jill Fukuhara,
Investor/Analyst Information, +1-310-996-7464, jfukuhara@webershandwick.com,
for DDi Corp.
(DDIC)

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